Chemical vapor deposition

Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.Microfabrication processes widely use CVD to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon, carbon fiber, carbon nanofibers, filaments, carbon nanotubes, SiO2, silicon-germanium, tungsten, silicon carbide, silicon nitride, silicon oxynitride, titanium nitride, and various high-k dielectrics. The CVD process is also used to produce synthetic diamonds.

Further information:

1. Schropp, R.E.I.; B. Stannowski, A.M. Brockhoff, P.A.T.T. van Veenendaal and J.K. Rath. "Hot wire CVD of heterogeneous and polycrystalline silicon semiconducting thin films for application in thin film transistors and solar cells" (PDF). Materials Physics and Mechanics: 73–82
2. Jaeger, Richard C. (2002). "Film Deposition". Introduction to Microelectronic Fabrication. Upper Saddle River: Prentice Hall. ISBN 0-201-44494-7
3. Smith, Donald (1995). Thin-Film Deposition: Principles and Practice. MacGraw-Hill
4. Dobkin and Zuraw (2003). Principles of Chemical Vapor Deposition. Kluwer
5. ISO 3529/1-1981 Vacuum Technology - Vocabulary - part 1: General
6. Article Chemical vapor deposition from Wikipedia, the Free Enciclopedia. Available under the license Creative Commons Attribution-Share Alike.

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