Etching

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete.
For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
The two fundamental types of etchants are liquid-phase ("wet") and plasma-phase ("dry"). Each of these exists in several varieties.

Further information:

1. Wolf, S.; R.N. Tauber (1986). Silicon Processing for the VLSI Era: Volume 1 - Process Technology. Lattice Press. pp. 531–534.
2. Wolf, S.; R.N. Tauber (1986). Silicon Processing for the VLSI Era: Volume 1 - Process Technology. Lattice Press. p. 546.
3. Bahadur, Birendra (1990). Liquid Crystals: Applications and Uses. World Scientific. p. 183.
4. Walker, Perrin; William H. Tarn (1991). CRC Handbook of Metal Etchants. pp. 287–291.
5. Kohler, Michael (1999). Etching in Microsystem Technology. John Wiley & Son Ltd. p. 329.
6. В. В. Усова, Т. П. Плотникова, С. А. Кушакевич. Травление титана и его сплавов.
7. М. Беккерт, Х. Клемм. Способы металлографического травления. Справочник.
8. Article Etching from Wikipedia, the Free Enciclopedia. Available under the license Creative Commons Attribution-Share Alike.

Back to Russian